Not every packaging patent defends a product. Some defend a licensing business. Invensas Corporation - part of the Xperi/Adeia family that monetizes IP through licensing rather than manufacturing - holds deep packaging portfolios, and its 2021 grant on an embedded organic interposer is a textbook example of an asset built to be licensed.
US11063017B2, "Embedded organic interposer for high bandwidth" (issued 2021-07-13), is classified in H01L 25/0655 (multi-chip assemblies), H01L 23/5383 (redistribution), H01L 25/18, and H05K 3/4694 (printed-circuit build-up). The claim covers an interposer built in an organic substrate - cheaper and more flexible than silicon - structured to support the high-density routing that high-bandwidth applications require.
Construe the limitation as the organic-versus-silicon distinction plus the embedding. A silicon interposer offers the finest pitch but at high cost; an organic interposer trades some density for cost and panel-scale manufacturing. The claim's value is the specific embedded-organic structure that recovers enough density for high-bandwidth use - the engineering compromise is the invention.
The commercialization angle is what makes this a 'From Claim to Market' story. Adeia/Invensas does not run a fab. Its revenue comes from licensing this IP to companies that do - foundries, OSATs, and packaging houses. So the patent's worth is measured in license agreements, not in products Adeia ships.
That changes how a freedom-to-operate analysis should treat it. A company building an organic interposer for HBM-class bandwidth is a licensing target, not a competitor Adeia will sue to exclude - the business model is to be paid, not to block. The negotiating posture differs accordingly.
For an IP-risk reader, embedded-organic-interposer claims from the Adeia family are worth flagging precisely because organic interposers are gaining ground as a cost-down alternative to silicon in cost-sensitive AI and networking packages. The licensing exposure grows as the technology spreads.